RESEARCH TRIANGLE PARK, N.C.--(BUSINESS WIRE)--Ziptronix, Inc. has signed a licensing agreement with Sony Corporation for the use of Ziptronix's patents regarding oxide bonding technology for backside illumination imaging sensors.
"We believe that Ziptronix's patented oxide bonding technology, called ZiBondTM, enables the industry's lowest distortion for imaging systems utilizing backside illumination" said Dan Donabedian, CEO of Ziptronix, Inc. "The result is that pixels can be scaled smaller, resulting in more die per wafer. Users of ZiBondTM technology benefit because yields are dramatically improved and production costs reduced."
Ziptronix's patented ZiBondTM technology enables significant advances in digital still cameras, digital video cameras, and cell phone cameras, and also in automotive sensors and projection systems, including pico projectors. Digital cameras, for example, that feature up to five megapixels today will advance to 16 megapixels using Ziptronix's patented technology. For consumer electronics, this means significant advantages in size reduction, lower power consumption, increased system performance, and better light rendering.
"Our patented bonding technology revolutionizes how light is received in imaging sensors. This is critically important for backside illumination applications," said Donabedian. "The market for image sensing products is expected to exceed $16 billion cumulative over the next four years. Because ours is an innovative, enabling technology, I expect Ziptronix to play a leadership role in the backside illumination space as well as several other developing markets."
About Ziptronix
Based in Research Triangle Park, NC, Ziptronix, Inc. is a pioneer in the development of low temperature oxide bonding technology for advanced semiconductor applications. Ziptronix is a leader in IP for innovative 3D integration technology for advanced CMOS ICs, with established patent protection for its ZiBondTM low temperature bonding (e.g. US Patent 6,902,987, 7,041,178, 7,335,572, 7,387,944) and DBI® direct bond interconnect (e.g. US Patent 6,962,835, 7,602,070) technologies. Founded in October 2000, Ziptronix was spun out from North Carolina's RTI International for the purpose of commercializing their revolutionary wafer and die bonding (ZiBondTM) and bonding with interconnect (DBI®) technologies. The company has an extensive worldwide patent portfolio covering the fundamental concepts behind economical low temperature oxide bonding and oxide bonding with interconnect. Ziptronix technology provides the lowest cost solution for low temperature wafer-to-wafer and die-to-wafer bonding, delivering significant advantages in size reduction, lower production costs, lower power consumption and increased system performance.
Contacts
Loomis Group
Sarah-Lyle Dampoux
Phone: +33-1-58-18-59-30
dampouxs@loomisgroup.com