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Freescale and Tongji University Introduce Reference Design for Anti-Pinch Window Lift System

2011-09-01 10:26
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Jointly developed design is based on Freescale S12 MagniV mixed-signal microcontroller Freescale Technology Forum China

SHENZHEN, China--(BUSINESS WIRE)--Freescale Semiconductor (NYSE: FSL) and Tongji University today announced a jointly developed reference design for automotive window lift systems. The reference design, based on the award-winning S12 MagniV S12VR64 mixed-signal microcontroller (MCU), provides a ready-to-use, rugged anti-pinch window lift control system that can help OEMs reduce development time and accelerate their time-to-market.

The single-chip S12VR64 is built on Freescale's innovative LL18UHV technology, which enables extensive analog integration on the MCU so developers can connect high-voltage signals and power supplies directly to the MCU in their automotive designs. This "direct-connect" capability helps save board space, increase system quality and reduce complexity and cost. Using the S12VR64 MCU as the basis for the new window lift reference design helps lower the system bill of materials, reduce the printed circuit board size and improve system performance.

Traditionally, automotive electronic designs have required multiple devices, including some created with a high-voltage process to connect to the battery and power actuator outputs, as well as MCUs created with a low-voltage digital logic process. This poses a challenge when the end application has space limitations.

"The S12 MagniV mixed-signal MCU optimizes integration of high-precision analog components with the proven S12 16-bit MCU," said Sun Zechang, associate president of Tongji Auto Institute. "When we were developing the anti-pinch window design, we selected the S12VR64 as the solution that can help customers meet their goals for cost savings, reduced board size and faster time-to-market. In those regards, the S12VR64 is much better than a traditional multi-component solution."

Tongji University's academic achievement in automotive technology is recognized within China and internationally. The Tongji Auto Institute is located in Shanghai's Auto City and has a close connection to automotive OEMs and parts manufacturers. Built in 2003, the Tongji-Freescale Automotive Electronics Joint Lab provides research and development in battery management, power systems, chassis and safety, body and car infotainment systems, and development of hybrid/electric vehicles. The joint lab has achieved remarkable results, such as the launch of fuel-cell vehicles based on Freescale Qorivva MPC55xx MCUs that were used in the 2008 Beijing Olympic Games and 2010 Shanghai World Expo.

"The window lift reference design based on Freescale's S12VR64 MCU leverages our automotive semiconductor leadership and process techniques," said Ray Cornyn, director of Freescale's Automotive Microcontroller Products. "Tongji University is one of the leading universities involved in automotive electronics research in China, and we are excited to continue our work together to introduce solutions for the automotive market."

S12 MagniV mixed-signal MCUs are based on the industry-leading S12 16-bit architecture and are software- and tool-compatible with other S12 devices, allowing developers to leverage their existing investments when using this reference design. The S12VR64 was recently awarded the 2011 Best MCU Award in the Automotive category by China Electronics News.

The S12VR64 MCU is included in the Freescale Product Longevity program, with assured supply for a minimum of 15 years. For details, terms and conditions, see www.freescale.com/productlongevity.

The window lift reference design was showcased at the Freescale Technology Forums (FTFs) in Bangalore, India, and Shenzhen, China, and also will be demonstrated at FTF Japan on September 13.

Availability

The window lift reference design is available now on a limited basis through direct engagement with Freescale Sales. It is expected to be available for purchase in the first half of 2012. For more information, visit here.

About Tongji Auto Institute

Located in Jiading campus in Shanghai International Automobile City, Tongji Auto Institute has conducted a broad range of research collaborations, academic exchange and personnel exchange with governments, universities, research institutions and enterprises from many countries and regions. Auto institute provides the world-class facilities for R&D and test of vehicles and parts, and is at the leading edge in automotive technology R&D, especially the new energy vehicles in China. Currently, it has three state-level engineering Labs and engineering technology R&D centers that are engaged in new energy vehicle R&D, and on top of this, its Shanghai Automotive Wind Tunnel Center and car modeling research center have been built.

About Freescale Semiconductor

Freescale Semiconductor (NYSE: FSL) is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial and networking markets. The company is based in Austin, Texas, and has design, research and development, manufacturing and sales operations around the world. www.freescale.com

About Freescale Technology Forum

Created to drive innovation and collaboration, the Freescale Technology Forum (FTF) has become the developer event of the year for the embedded systems industry. The Forum has drawn more than 40,000 attendees at FTF events worldwide since its inception in 2005.

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. MagniV and Qorivva are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.

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Freescale Semiconductor
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Andy North, 512-996-4418
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Laurent Massicot, 33-16) 935-7712
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Anjali Srivastava, (91-120) 395-0000
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Masako Tanikawa
Freescale Semiconductor, (81-3) 5437-9128
masako.tanikawa@freescale.com