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Technology Press Releases

2013-04-01 15:41 Toshiba Expands Line-up of Discrete IGBTs for General and Industrial Purposes
2013-03-29 17:39 ZTE Wins Patent Case against Huawei in Paris District Court
2013-03-29 16:51 Toshiba to Launch Full-HD, 1.12 Micrometer, CMOS Image Sensor with Color Noise Reduction
2013-03-29 16:41 Alibaba Group and MasterCard Sign Memorandum of Understanding to Enhance e-Commerce Environment
2013-03-29 12:54 Toshiba Launches New Single-Lane (Two Differential Channel) SPDT Bus Switch ICs Supporting PCI Express Gen3 (8Gbps)
2013-03-28 09:54 Havok™ Liberates Mobile Developers with Project Anarchy!
2013-03-27 16:50 ZTE’s Micro-Base Station Enhances CSL’s Services at Rugby Sevens 2013
2013-03-27 15:39 i-DNS.net Files Legal Rights Objections Against IDN gTLD Applications Filed by Chinese Internet Authorities
2013-03-26 16:25 Tigo in Colombia Launches Access to Facebook®for All Its Subscribers Using Gemalto’s Facebook for SIM Mobile Application
2013-03-26 15:48 New Enhancements to the Datacard®MX Series Platform Provide Quality Assurance Technologies, Enhanced Security Features and Faster Speeds for Central Card Issuance
2013-03-26 15:36 Safaricom selects Gemalto’s cloud-based solution to offer Kenyan mobile users phonebook back-up services
2013-03-26 14:26 MSCI Launches New Version of Barra Portfolio Manager
2013-03-26 13:33 Android Monetization Platform "metaps" Announces Collaboration with Vietnam's Largest App Market "Appota"
2013-03-25 15:46 US$24Billion Spent on ID Card and eGovernment Programs in the Past Ten Years as Biometric Systems Replace Old Technologies
2013-03-25 15:00 CARTES in Asia 2013
2013-03-25 10:02 New Ixia Solution Provides Unprecedented Visibility Into Rapidly Growing 4G LTE Networks
2013-03-22 17:38 ZTE Welcomes Rulings by Düsseldorf District Court
2013-03-22 16:47 Finalists of Asia Pacific’s Smart Card & ID Innovation Revealed
2013-03-22 15:58 Crystal IS Announces Record Performance from a Single Chip UVC LED
2013-03-22 15:35 Toshiba Launches Fiber Optic Transmission Modules with Low Consumption Current Horizontal and Vertical -type Packages Lined-up for Energy-Sensitive Applications

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