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Technology Press Releases

2013-10-08 20:25 NEC and Maestro Wireless Form Strategic Partnership for M2M Business
2013-10-08 17:32 Netsize, the world’s leading operator billing platform, achieves PCI DSS certification
2013-10-08 17:25 Toshiba Launches High Current Photorelays with Reinforced Insulation
2013-10-08 17:18 IEEE Launches World Forum on Internet of Things (WF-IoT) Series
2013-10-08 17:04 Secure Identity Alliance welcomes new members
2013-10-08 16:54 Surfing in the Skies on Singapore Airlines Powered by Deutsche Telekom
2013-10-08 16:18 Entel First in Chile to Give Mobile Access to Facebook to Any Subscriber with Gemalto Software Solution
2013-10-08 16:15 iLEVEL Expands Internationally with London Office
2013-10-08 16:06 Qumu Recognized as a Leader in First Gartner Magic Quadrant for Enterprise Video Content Management
2013-10-08 15:52 Citi Launches e for Education
2013-10-08 15:32 Gemalto selected for Belgian ePassport
2013-10-08 15:10 Japan Aviation Electronics to Exhibit at CEATEC JAPAN 2013
2013-10-08 14:36 Oerlikon Receives Multiple Orders for the CLUSTERLINE® 300 from a Leading Power Device Manufacturer.
2013-10-08 14:11 Evergreen Acquires Japan's Largest Self Storage Company, Quraz
2013-10-08 13:35 ZTE USA Announces Its First Corporate Partnership and Consumer Marketing Push in Conjunction With the Houston Rockets
2013-10-08 13:31 ZTE’s Grand S™ Makes a Grand Entrance in the U.S.
2013-10-08 13:24 The ZTE nubia 5™ Packs Advanced Photography and Entertainment Into the Palm of Your Hand
2013-10-01 13:00 SATEL releases a new Module for long-range wireless data transmission
2013-10-01 08:00 ULIS Demonstrates Micro80P, the First in a New Generation of 80x80 Micron Thermal Sensor Arrays at CEATEC Japan, October 01 - 05, 2013 at Stand 2B36
2013-09-30 17:37 Toshiba Starts Sample Shipments of Bluetooth® IC for Small Sized Applications such as Thermal Sensors and Toys