BILLERICA, Mass.--(BUSINESS WIRE)--NEXX Systems will reach another major milestone this summer as it celebrates 10 years of delivering industry-leading semiconductor packaging equipment that significantly increases customer capabilities and productivity. As electronics demand more functionality in smaller spaces, NEXX has become an advanced packaging leader, with annual revenues growing from $18.3 million in 2008 to $54 million in 2010. Consistently increasing the rate of company shipments year after year for the past three years, CEO, Tom Walsh helped develop founder Dr. Richard Post’s vision of a company at the forefront of the mounting advanced packaging market. “NEXX Systems is excited to use our innovative technology to introduce solutions that provide our customers with a competitive edge,” stated Tom Walsh.

Since 2001, NEXX Systems has expanded its customer base to forty, with one hundred and thirty-five systems in place and millions of wafers processed. In the past several years, NEXX has become a global company with offices and customers throughout North America, Europe, Japan, Philippines, China, Singapore, Malaysia, Korea and Taiwan.

The NEXX product family consists of two advanced packaging systems, Stratus and Apollo. The Stratus, an electrochemical deposition system (ECD), was the first production plating tool with twenty wafer plating positions. Our expertise in copper pillar and lead-free production methods has resulted in the Stratus being the only tool in the market with dual-sided production plating capabilities. The Stratus vertical wafer processing technology in combination with its single linear cell configuration makes it one of the easiest to maintain and capable of handling wafers as thin as 50µm to 200µm. The majority of these high-volume production Stratus systems are processing 300mm wafers at large foundry and integrated device manufacturing (IDM) customers in Taiwan, Korea and the U.S.

The Apollo, a physical vapor deposition system (PVD) is one of the most flexible, smallest footprint and most economical sputtering tools on the market. The Apollo can utilize up to five metals in a single deposition chamber. Wafers are loaded in atmosphere and processed safely on trays – resulting in superior film deposition with no oxide re-growth between metal layers. With wafer size and thickness conversions of less than an hour, the Apollo has the processing flexibility to address an array of applications, from CMOS image sensors to flip chip bumps to LEDs. Our PVD tool is a flexible and high productivity solution for Au bump, thin wafer back side metallization (BSM) and insulated gate bipolar transistor applications (IGBT).

NEXX Systems will celebrate its 10th Anniversary this summer at its headquarters in Billerica, Massachusetts. A second celebration will be held in China in conjunction with the grand opening of its Shanghai office and the commitment to build an Asian Center of Excellence. NEXX Systems will be at SEMICON West on July 12 – 14, 2011 in San Francisco at booth 1325 in South Hall.

NEXX Systems brings exceptional technical expertise to flip chip and advanced packaging. The two product lines provide the most efficient, yet affordable, systems of their kind: Stratus for high throughput electrochemical deposition of metals and Apollo for multi—layer physical vapor deposition of metals. Additional information can be found at www.nexxsystems.com

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