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Samsung Electro-Mechanics to Showcase Latest Innovative Electronic Component Technology at China Hi Tech Fair 2014

2014-11-14 17:21
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China Hi-Tech Fair 2014

SEOUL, South Korea & SHENZHEN, China--()--Samsung Electro-Mechanics(KRX:009150), the global integrated electronic components producer, is participating in the 16th China Hi Tech Fair ELEXCON 2014 from Nov. 16 till Nov. 21 in the Chinese city of Shenzhen where a wide range of high tech convergence technologies and components will be in display.

It will be the first time the company has participated in an IT and electronic exhibition in China. By taking part as a main sponsor, the company will demonstrate its technological innovations and increase its presence in the emerging Chinese market.

The company will be displaying a variety of products, including components for smartphones, products for wearable devices and automotive items in the experimental zone to prove its capacity for providing integrated solutions for the IoT industry.

Products for smartphone application include a camera module which boasts optical image stabilizing (OIS) 16 mega-pixels with improvised angling which is the most advanced in the word. In addition, there will be passive components integrated package substrates for high-performance application processor as well as modules for Wi-Fi and wireless LTE applications.

In the area of wearable devices, items like A4WP Rezence-type wireless charging units for smart watches which makes it possible to be charged regardless of the direction or location of the wireless charging transmitter or receiver devices will be on display. In addition to HDI-Flex PCB that bands freely.

There will also be multi-function sensor modules for next generation wearable products which provide diverse functions including UV meter and Ambient Light Sensing (ALS) applications in a single module.

As for automotive components, Samsung will present Multi-Layer Ceramic Capacitors (MLCC), miniaturized beads and high reliability and high performance passive chip components.

The greatest focus Samsung is placing on is a diverse range of convergence technology based on IoT. The highlight would be the wireless lighting control system which can handle thousands of lighting devices depending on the environment, including their brightness.

Meanwhile, Samsung Electro-Mechanics, which owns the best solutions in terms of electronic shelf label (ESL), is presenting full line-up of ESL including seven-segment type ESL and graphic type ESL which boasts detailed coloring and imaging. The company emphasized that ESL used at shops can be expanded as a tool for IoT and management innovation from just a tool for displaying product prices.

“Samsung Electro-Mechanics has the experience and proven mass-production capabilities for advanced electronic components and we are providing solutions that are differentiated from our competitors. With our unique software and hardware expertise, we will continue to move into the Chinese market with strategic partnerships, particularly with our IoT-based technologies,” said company CEO Choi Chi-joon.

Through its participating in this fair, Samsung Electro-Mechanics will be able to promote its technology and vision for future growth while organizing meetings with clients for on-site product demonstration and investments.

Samsung Electro-Mechanics’s exhibition booth is at Shenzhen Convention & Exhibition Center Hall 2- 2D61.

About Samsung Electro-Mechanics Co., Ltd.

Samsung Electro-Mechanics (SEMCO), established in 1973 as a manufacturer of key electronic components, has become a major global player in the field of electronic components. SEMCO is a technology-driven company and focuses on developing state-of-the-art technologies and parts. SEMCO has been intensively developing PCBs, chip components, camera modules, power supplies, tuners, network modules and motors into the world’s very best. In addition, the evolution of information technology is accelerating our development of parts that are more energy efficient and environment friendly, and our abilities are being focused on seeking out new business areas with future growth potential such as retail solution, Internet of Things and automotive.

 

Contacts

Samsung Electro-Mechanics (Shenzhen, China)
Keungmo Ryu, +86-185-7669-1503
ryu0502@samsung.com
or
Samsung Electro-Mechanics (HQ, Korea)
June Yang, +82-10-2000-4284
jsjs.yang@samsung.com

 

This is a HDI-Flex PCB for wearable devices produced by Samsung Electro-Mechanics on display at the 16th China Hi Tech Fair ELEXCON 2014. (Photo: Business Wire)

This is a HDI-Flex PCB for wearable devices produced by Samsung Electro-Mechanics on display at the 16th China Hi Tech Fair ELEXCON 2014. (Photo: Business Wire)