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Ralink Announces World’s Most Integrated 802.11n Chipsets

2009-06-02 17:32
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Single-Chip PCIe and Router Solutions Offer Seven Times Greater Throughput Than Typical 802.11b/g With Lower Cost, Smaller Footprint, and Lower Power Consumption

COMPUTEX TAIPEI 2009

HSINCHU, Taiwan--(BUSINESS WIRE)--Ralink Technology, a leading developer of high performance wireless solutions, today announced the launch of its RT3350 router-on-a-chip and RT3390 NetBook client, the world’s most integrated 802.11n chipsets. With radio, baseband and power amplifiers all contained on a single die, these chipsets deliver the high performance, low power consumption and attractive pricing required for integration into today’s high volume PC, router, broadband connectivity, and consumer electronics products.

"The new RT3390 and RT3350 provide the optimal solution for customers aiming to capitalize on the growing market for high-performance yet cost effective WLAN chips," said Horen Chen, president of Ralink Technology. "Our new chips are easy to integrate, and provide performance and flexibility that meet today’s market demand for small, inexpensive yet high-performance devices. Our latest offerings allow manufacturers to get their products to market quickly while also ensuring an optimal cost performance."

Following last year’s production release of Ralink’s first ever single-chip 802.11n RT3090 client and RT3050 router solutions, Ralink has integrated 14 additional components including high-performance power amplifiers, resulting in unprecedented levels of 802.11 chip integration, reducing system-level bill of material cost, and simplifying design, test and manufacture.

"These chips are designed for high performance and low power consumption to address all segments of the thriving notebook and broadband connectivity markets, from NetBooks to high-end gaming machines, and from entry-level access point to all-in-one broadband gateways," said Zachary Wu, Vice President & Components Business Group General Manager of Synnex Electronics.

The RT3350 router-on-a-chip includes an 802.11n media access controller (MAC) and baseband, a 2.4GHz radio, a 320 MHz MIPS® 24K™ CPU core, a 5-port Fast Ethernet switch and physical layer devices (PHYs), various options for system memory, and a high-performance power amplifier which outperforms competitor’s solutions with external power amplifiers. The RT3350 requires fewer and less expensive external components than competitor solutions, and includes everything needed to build a router from a single WLAN chip. The RT3350 is also the only solution available with interfaces capable of incorporating a 3.5G modem, or to function as a print server.

The RT3390, a further cost-reduced 802.11n PCIe client solution delivers 7X throughput and up to 30% better range compared to legacy 802.11g devices in NetBooks and full-featured laptops. The RT3390 features an integrated high-performance 2.4GHz power amplifier and low noise amplifier, power detector, transmit and receive switch, and diplexers in a miniature package that measures only 8mm x 8mm.

The RT3390 and RT3350 chips will be sampling this quarter and available in high-volume production quantities by Q4 2009.

About Ralink Technology

Ralink Technology Corporation is a leading innovator and developer of wireless chipset solutions. Ralink products are recognized for the superior throughput, extended range, low-power consumption and consistent reliability required for Wi-Fi, mobile and embedded applications. These feature-rich chipsets have a high level of chip integration, enabling customers to build smaller and more sophisticated mobile wireless products cost-effectively. Ralink’s patented MIMObility™ technology extends Wi-Fi applications from traditional PC networking to a range of digital multimedia and handheld devices including cell phones, PDAs, cameras, print servers, HDTV and video game players. Ralink customers can look forward to continuous improvements in speed, bandwidth and reliability with IEEE 802.11n solutions for next-generation high-performance Wi-Fi. Ralink Technology was founded in 2001 with headquarters in Hsinchu, Taiwan and an R&D center in Cupertino, California. For more information, visit Ralink at www.ralinktech.com

Ralink, Ralink Technology and MIMObilityTM are Ralink’s registered trademarks; All other trademarks mentioned in this document are the property of their respective owners.

Contacts

Ralink Technology Corporation
Taiwan Media Contact:
Max Hsu, +886-3-560-0868
Max_Hsu@ralinktech.com.tw
US Media Contact:
Joe Volat, 408-725-8070
jvolat@ralinktech.com