The new PAC5523 contains the highest-performance MCU found in an integrated motor control and driver product on the market. It contains a 150MHz Arm® Cortex®-M4F MCU with 128kB FLASH, 32kB SRAM and an integrated Floating Point Unit (FPU) with Digital Signal Processor (DSP) instructions for highly efficient implementation of motor control and drive applications. The MCU also contains 4-level code protection, a cache for high-speed FLASH access, ECC for SRAM data and a CRC engine.
The PAC5523 also integrates highly-optimized peripherals specifically designed for BLDC motor control applications.
The 70V PAC5523 is optimized for battery-powered and other BLDC applications up to 48V. Integrated with the high-performance MCU is the power management, gate drivers and signal-conditioning for 3-phase inverter applications. The PAC5523 may be directly supplied with a battery of up to 20 or higher voltages using the 70V DC/DC Buck or SEPIC controller Multi-Mode Power ManagerTM (MMPM). The PAC5523 implements a Total Hibernate ModeTM which manages battery life and system efficiency by reducing quiescent current to 18uA.
The Application-Specific Power DriversTM (ASPD) integrates 70V/1.5A gate drivers for high power applications with 2-level dead-time protection for the external MOSFET-based inverter. The Configurable Analog Front-EndTM (CAFE) contains 3 Differential Programmable Gain Amplifiers (PGAs), 4 single-ended PGAs, 10 comparators, buffers and DACs that can be used for signal sampling and filtering for the control applications, minimizing the need for external components.
“The PAC5523 contains both a high-performance and high-memory MCU with integrated 70V DC/DC Controller and Gate Drivers, configurable analog front-end, coupled with active-semi®’s Total Hibernate Mode™ and other patented features, delivers the highest-performing and smallest system design at the highest system efficiency,” says David Briggs, Vice-President and General Manager at active-semi®. “We are excited about the rapidly expanding customer base that is now ramping into production with PAC5523.”
In a small 6mm x 6mm QFN package with all of the integration, the PAC5523 can realize an extremely small BOM and physical design size for compact BLDC battery-powered applications.
The PAC5523EVK extends the PAC® family of evaluation kits (EVKs) enabling fast prototyping for various applications including power tools, garden tools, telecom fans, battery-powered vehicles, drones, radio controlled cars, and general-purpose BLDC applications. Along with active-semi®’s motor control firmware and IP library, the PAC5523 will simplify system development with sensored and sensorless FOC and sensorless trapezoidal motor control applications for high-voltage battery powered applications.
PAC5523 IC and PAC5523EVK1 are available from leading distributors.
For more information on active-semi® and Intelligent Motor Control solutions, visit https://active-semi.com/products/intelligent-motor-control.
About active-semi®
Founded in 2004 in Silicon Valley and headquartered in Dallas, Texas, active-semi® is a rapidly emerging leader in multi-billion-dollar power management and intelligent digital motor drive IC markets. The company’s portfolio of analog and mixed signal SoCs provide scalable core platforms used in charging, powering and embedded digital control systems for industrial, commercial and consumer applications. active-semi® offers Power Application Controllers® (PAC®), DC-DC and ActivePMU™ products that significantly reduce solution size and cost, improve system reliability, and shorten system development cycle-time.
active-semi® is a multi-national company with over 170 patents granted and pending. active-semi®International Inc. is a Cayman Island corporation backed by leading Venture Capital firms, including USVP, Tenaya Capital, LG and LDV Partners.
More information at www.active-semi.com